Hálfleiðaraforrit í varmaiðnaði

     Heatsink is a general term for a series of devices used to conduct and release heat. Flestir heatsinks munu gleypa hita með því að snerta yfirborð hitunarhluta, og flytja síðan hitann til annarra staða með hitaleiðni, sem felur í sér hitaleiðni háttur heatsink, aðal leiðin til varmaleiðni ofnsins. Í varmafræði er hitaleiðni varmaflutningur. Varmi er aðallega fluttur á þrjá vegu: varmaleiðni, varmaflutning og varmageislun.

       In addition to the common air cooling and liauid cooling heat dissipation, the CPU heatsink we can use also can be a semiconductor heatsink. The basic principle of semiconductor heatsink is to transfer heat to the hot end (fin) through the semiconductor and take away the heat of the fin through the fan. Therefore, heat dissipation is essentially completed through the fan and fin, but heat is transmitted through the semiconductor. Therefore, most of the power consumption of semiconductor radiator is used for the operation of semiconductor heat conducting materials.

        Semiconductor refers to the material whose conductivity is between conductor and insulator at room temperature. Common semiconductor materials include silicon, germanium, gallium arsenide, indium phosphide, etc. Silicon is the most successful and widely used semiconductor material in commercial applications among all kinds of semiconductors.

      Semiconductor crystal will have controllable conductivity after being doped with specific impurity elements, which makes semiconductor the best material for manufacturing electronic chips. Due to the demand for chips in consumer electronics, new energy vehicles, smart home appliances, communication base stations and other fields, chips have formed a high demand in recent years. Due to technical limitations and costs, chip resources are becoming more and more tight, and semiconductors are becoming the focus of the market.

     Although the of semiconductors has developed rapidly, the development of materials is not mature. It is expected that it will take a long time for the fabrication and process maturity of a new generation of semiconductor chips.

     At the moment of looking for substitutes and chip consumption degradation, the heat dissipation problem will become the next urgent problem to be solved in the fields with high demand and high performance requirements for chips such as consumer electronics and new energy vehicles.